EN61190-1-3:2002

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EN Standards: EN61190-1-3:2002



Standard No EN61190-1-3:2002
Title of Standard Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
ISBN 058040234 7
Date of Publication 12/08/02
Approx Pages 38
Description Electronic equipment and components, Electronic engineering, Electrical connections, Bonding, Soldering, Solders, Soldering fluxes, Quality control, Quality assurance, Bars (materials), Particulate materials
Cross references IEC 61189-5, IEC 61189-6, IEC 60194:1999, IEC 61190-1-1, EN61190-1-1:2002, IEC 61190-1-2, EN61190-1-2:2002, ISO 9002, ENISO 9002:1994, ISO 9453:1990, EN29453:1993, ISO 9454-1, EN29454-1:1993, ISO 9454-2, ENISO 9454-2:2000
International Equiv (If Applicable ) EN61190-1-3:2002 IEC 61190-1-3:2002
Replaces Standards :
Replacement Notes
Now Replaced By
Replaced by Notes
Committee Ref EPL/501


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